It depend if the assembly is sealed or not. If there are open components,
relays, connectors or for example BGA components with open via hole under.
It will be almost impossible to assure the cleanliness of the assembly.
Reuven
On Sun, Sep 11, 2011 at 10:14 PM, Kane, Joseph E (US SSA) <
[log in to unmask]> wrote:
> Tropical Storm Lee dumped about 9 inches of rain on Binghamton, and we got
> the second hundred-year flood in five years. But this one was lots worse
> than in 2006. Cities and towns were inundated, and a lot of people have
> lost their homes here. And this time the Susquehanna River overtopped the
> levee and flooded our plant.
>
> The water has receded and we were able to send people inside yesterday to
> assess damage. A lot of our product is wet and muddy, from components on
> reels on up to finished assemblies. And essentially all of our assembly and
> test equipment has been at least partly submerged.
>
> Not sure if we can get some of our cleaning equipment restored soon,
> including aqueous batch dishwashers and an in-line aqueous cleaner. If we
> have to clean product in buckets or tubs, we're thinking about these steps:
>
> 1. Soapy/alkaline water solution, scrub as necessary
> 2. At least two rinses, last one DI
> 3. Blow off with compressed air (or nitrogen if available)
> 4. Bake
> 5. Ionic contamination testing on samples
>
> Our conformal coat is mostly urethane. Some assemblies have unsealed
> connectors, switches, and pots. Some motherboard/front panel assemblies
> have lots of wires.
>
> Anybody have any experience cleaning river mud from electronics?
>
> Joe Kane
> BAE Systems
> Johnson City, NY
>
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*Reuven Rokah*
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