Or copper to copper? The short answer is it’s a board defect. But the
question, "Was this caused by Nickel passivation", cannot be answered
without first knowing if it was gold peeling off the nickel, or nickel
peeling off the copper plate or copper plate peeling from the copper base.

Guy



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Friday, September 09, 2011 2:33 PM
To: [log in to unmask]
Subject: Re: [TN] What caused gold peel off from gold finger?

CC:
Whatever the separation, Gold from Nickel, or Nickel from Copper, the root
cause is plating on to a surface covered in some soil or oxide, not on to
bare metal.

A very common cause (may not be your problem) is leaving parts (fingers) in
rinse waters too long between cleaning and plating.   This allows oxides to
form, so plating occurs on oxide, not  on bare metal.

Rudy Sedlak
RD Chemical Company

--- On Fri, 9/9/11, Charming Chan <[log in to unmask]> wrote:

From: Charming Chan <[log in to unmask]>
Subject: [TN] What caused gold peel off from gold finger?
To: [log in to unmask]
Date: Friday, September 9, 2011, 9:31 AM

Hi All, 

Would you all help check out this peel off defects for any possible cause?
The gold fingers were protected with 3M tape and reflowed for soldering, the
plating peel off from gold fingers when strip 3M tape after reflow soldering
finished. In appearance, the peel-off plating is possible gold layer. 

My question is , It's caused by nickel passivation? Any methods to analyze
the root cause?


Hi Steve, 

Would you help get the defect picture posted? Thanks.


Best Regards
Charming Chan




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