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September 2011

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Fri, 9 Sep 2011 11:32:59 -0700
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CC:
Whatever the separation, Gold from Nickel, or Nickel from Copper, the root cause is plating on to a surface covered in some soil or oxide, not on to bare metal.

A very common cause (may not be your problem) is leaving parts (fingers) in rinse waters too long between cleaning and plating.   This allows oxides to form, so plating occurs on oxide, not  on bare metal.

Rudy Sedlak
RD Chemical Company

--- On Fri, 9/9/11, Charming Chan <[log in to unmask]> wrote:

From: Charming Chan <[log in to unmask]>
Subject: [TN] What caused gold peel off from gold finger?
To: [log in to unmask]
Date: Friday, September 9, 2011, 9:31 AM

Hi All, 

Would you all help check out this peel off defects for any possible cause? The gold fingers were protected with 3M tape and reflowed for soldering, the plating peel off from gold fingers when strip 3M tape after reflow soldering finished. In appearance, the peel-off plating is possible gold layer. 

My question is , It's caused by nickel passivation? Any methods to analyze the root cause?


Hi Steve, 

Would you help get the defect picture posted? Thanks.


Best Regards
Charming Chan




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