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September 2011

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Subject:
From:
Charming Chan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charming Chan <[log in to unmask]>
Date:
Fri, 9 Sep 2011 12:31:34 -0400
Content-Type:
text/plain
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text/plain (33 lines)
Hi All, 

Would you all help check out this peel off defects for any possible cause? The gold fingers were protected with 3M tape and reflowed for soldering, the plating peel off from gold fingers when strip 3M tape after reflow soldering finished. In appearance, the peel-off plating is possible gold layer. 

My question is , It's caused by nickel passivation? Any methods to analyze the root cause?


Hi Steve, 

Would you help get the defect picture posted? Thanks.


Best Regards
Charming Chan




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