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September 2011

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From:
"Noel, William J - GS" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Noel, William J - GS
Date:
Thu, 8 Sep 2011 09:59:34 -0400
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Thanks, Wayne - I sincerely appreciate the input.  I've been tracking this issue for another engineer here at ITT so I will forward your input to him.  Thanks again.

Bill Noel
ITT
Geospatial Systems Division
400 Initiative Drive
Rochester, New York  14606-0488
P: (585) 269-5911
F: (585) 672-8042


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IIW
Sent: Wednesday, September 07, 2011 4:40 PM
To: [log in to unmask]
Subject: Re: [TN] Gold / Nickel Plating

Hi Bill-

Feel free to give me a call to talk about this since we have a bunch of experience designing with flex and wirebonds.  I agree with Steve, but would add that that amount of plating will embrittle the flex, so make sure it doesn't bend where there's plating.  Also, if too much soft gold, the ultrasonics don't like it--the vast amount of mushy material dampens the "scrub".

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Friday, September 02, 2011 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Gold / Nickel Plating

Bill,

You did not indicate whether you were using Au or Al wire.

If using a thermosonic gold process, all should be well.  The wire will
adore the extra gold, so long as it is as specified, and not 'hard'

However, if you are Al bonding, you have way too much gold thickness
allowed, even in the original specification [which makes me think you are Au
bonding - I hope!]

Julie's comment is correct as it applies to Au bonding.  However, with Al we
just blast through the surface oxides the majority of the time.

Where can the rest of us go to get some free/extra gold??

Regards


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
              616 834 1883



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Noel, William J - GS
Sent: Tuesday, August 23, 2011 12:29 PM
To: [log in to unmask]
Subject: [TN] Gold / Nickel Plating

Hello all -
We have some flexes that were designed for a wire bonding application and
the finish in the wirebonding area was specified on the fabrication drawing
as follows:

BOND PAD AREAS, AS DEFINED BY THE EXPOSED COPPER AREA, SHALL BE PLATED AS
FOLLOWS: 30 - 100 MICROINCHES OF SOFT GOLD PER
MIL-G-45204, TYPE III, GRADE A OVER 200 -100/+250 MICROINCHES OF SOFT NICKEL
PER MIL-P-27418. (SULFAMATE BATH) GOLD PLATING
UNDER THE OUTER LAYER LAMINATE IS ALLOWED TO A MAXIMUM OF .050

Upon inspection, we are finding samples that exceed the maximums in the area
of 400-500 microinches of gold and 500-600 microinches of nickel.  We are
wondering if these would still be acceptable for our wirebonding
application.  Any help?  Thanks in advance.

Bill Noel
ITT
Geospatial Systems Division
400 Initiative Drive
Rochester, New York  14606-0488
P: (585) 269-5911
F: (585) 672-8042




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