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September 2011

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Subject:
Re: QFN with solder slug
From:
Pete <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Pete <[log in to unmask]>
Date:
Thu, 8 Sep 2011 08:47:55 -0500
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text/plain
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Our "cheap" way to address this is to arrange the (open) vias in  + pattern, allowing the stencil design to apply paste in 4 areas not touching the vias.  Doesn't fix the problem, but it has helped reduce voiding and see-sawing.

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