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September 2011

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Subject:
From:
James Layer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, James Layer <[log in to unmask]>
Date:
Thu, 29 Sep 2011 16:47:32 -0400
Content-Type:
text/plain
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text/plain (81 lines)
Hi,

	Is there any requirements for soldermask thickness at the knee
of a tented Via?  Any reliability concerns?

Thanks
Jim

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Thursday, August 18, 2011 11:00 AM
To: [log in to unmask]
Subject: Re: [TN] IPC spec for split and mixed planes

Don't.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Micahel T. Handy
Sent: Thursday, August 18, 2011 7:57 AM
To: [log in to unmask]
Subject: [TN] IPC spec for split and mixed planes

To all, is there an IPC specification for design of split/mixed plane
design. I'm looking for design parameters for the gap spacing between
split planes and how to place thru hole vias between the isolated
planes. Any help would be greatly appreciated.
Mike Handy

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