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September 2011

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Subject:
From:
vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Thu, 29 Sep 2011 19:37:31 +0000
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I should probably also say that the supplier was not able to reproduce the problem. They have a better temperature control in the cooling zone, compared to the ovens used over here by the customer.
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Paul Edwards <[log in to unmask]>
Date: Thu, 29 Sep 2011 11:35:25 
To: [log in to unmask]<[log in to unmask]>; [log in to unmask]<[log in to unmask]>
Subject: RE: [TN] Board question

When the PCB is run through the oven is it on rails or on the belt?
The second question is, how long in the PCB about Tg?
The third question is, is the thermal profile at the PCB surface the same for both sides?

Paul


Paul Edwards
Process/Quality Engineering
Surface Art Engineering


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev
Sent: Thursday, September 29, 2011 11:30 AM
To: [log in to unmask]
Subject: Re: [TN] Board question

Thank you Phil,

There was virtually  no time difference between runs of the two different boards.

I have to check the tabs, though. 

I'm holding off for the thermal analysis, as (as I said) it doesn't make much sense to me just now. Why would a board go back to normal if the laminate was undercured prior to the first run?
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Phil Bavaro <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Thu, 29 Sep 2011 11:03:23 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject: Re: [TN] Board question

Does it violate the spec for twist after the first reflow?  Does it
matter which side is run first?

Internal layer thieving can cause this.  Typically every supplier does
their thieving differently.  

Does the panel have outside rails?  

Ask the supplier for their fab gerber used to actually make the panel.
Usually since rails get discarded throw away piece, the board suppliers
take liberties and modify the rail conductor fill to optimize their
plating processes.  You may see the outside conductors as identical but
I have always noticed the thieving in panel rails vary between suppliers
since it is not defined as part of the original pwb gerber.

I am also not sure that you ran the two different supplier panels side
by side through the oven at the same time but such a check would be good
to do if it has been a long time since the "good" supplier boards have
been run.

Joyce also has the right idea....sometimes Tg is different if it is not
a hard call out.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Thursday, September 29, 2011 10:54 AM
To: [log in to unmask]
Subject: Re: [TN] Board question

Hi Vlad - one other thing to check - is the pwb stack up "balanced"? Are

all of the layers (both the dielectric and the copper) symmetrical with 
respect to the board thickness midpoint? Are you sure all of the 
thicknesses are equal?

Dave Hillman 
Rockwell Collins
[log in to unmask]



"Vladimir Igoshev. PhD" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
09/29/2011 11:49 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
"Vladimir Igoshev. PhD" <[log in to unmask]>


To
<[log in to unmask]>
cc

Subject
[TN] Board question






Hi TechNetters,

I have a question for board gurus, as I'm almost lost.

Here is a story. A panel of four simple 4 layers FR4 twists after
going through the first side re-flow and flatten out after the second
side is re-flowed.   It does the same thing with and without the
components placed.

The panels are from  new vendor and the old ones had never exhibited
the problem. What confused me is that both boards (from both of the
vendors) were built identically: dielectric layers and  Cu
layers are look identical thickness- wise.

There are no signs of resin recession or delamination in
cross-sections which could have pointed out at incomplete curing.

Glass bundles look also identical.

What else it could be?

Any suggestions are deeply appreciated.
-- 
Best regards,

Vladimir Igoshev. PhD                          
mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca


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