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September 2011

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 2 Sep 2011 14:02:44 -0400
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yap

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Friday, September 02, 2011 1:57 PM
To: [log in to unmask]
Subject: Re: [TN] Gold / Nickel Plating

I asked a wirebonding expert here, and he said the excessive gold thickness should not be a problem for you.  You would have an issue with too little gold and nickel migration through the grains forming oxides on top.  
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