TECHNET Archives

September 2011

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
Date:
Fri, 23 Sep 2011 16:56:30 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines)
I'm looking for help solving a quality/reliabilty problem with cracked solder on fine pitch SMT  solder joints.    Have not been able to completely eliminate the condition and from time to time see downstream failures that exhibit the cracked solder condition.   Our own process experts are ready to find an outside consultant that can guide us to health.  What's the best way to find an effective expert  in the LA area that we might hire to consult with.  
 
Mark Julstrom

______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2