Hi Steven.

We're using AURUNA 516 autocatalytic thick Gold from Umicore and it was
added to our ENIG line without problems.

Simon

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
> Sent: Tuesday, September 20, 2011 10:38 PM
> To: [log in to unmask]
> Subject: [TN] Direct immersion gold
> 
> Hi All,
> Anyone know of a  gold system process that allows me to build 
> gold to a thickness of .4 to .9 microns on top of 2.5 microns 
> of nickel. No electroplating connection to 98% of the pads 
> (not even through the back side) . Customer insists this can 
> be electroplated - is this the DIG process. I do not want to 
> use gold as the etch resist. Thanks. Steve Kelly
> 
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