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Subject:	Direct immersion gold
From:	Steven Kelly <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:	Tue, 20 Sep 2011 15:38:01 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (13 lines)

Hi All,
Anyone know of a  gold system process that allows me to build gold to a thickness of .4 to .9 microns on top of 2.5 microns of nickel. No electroplating connection to 98% of the pads (not even through the back side) . Customer insists this can be electroplated - is this the DIG process. I do not want to use gold as the etch resist. Thanks. Steve Kelly

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