Just the assembly house is not objective...

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ב-Sep 20, 2011, בשעה 11:12 PM, Carl VanWormer <[log in to unmask]> כתב/ה:

> (Resent after editing for better communication:)
> 
> There is a mix of opinions, including black pad, un-melted solder,
> Nickel-Tin interface, reflow profile; ENIG is evil, wetting problems and
> brittle fractures (and maybe more).  
> 
> I just finished checking the 20 boards we have on the shelf, finding 2
> more with the problem.  On the bad assemblies, all of the solder pulls
> off the PCB pad, leaving the pad with no Gold.  Turning my destructive
> tendencies to (THE GOOD) assemblies; if I pull hard enough on the SMT
> electrolytic cap, the cap leads pull out of the solder blob with the
> expected blob surface tearing.
> 
> Our board assembly house has asked for the bad boards so they can
> evaluate the problem.  They will probably have the experience to make a
> proper determination of root cause.  If they do come to a conclusion,
> I'll let the group know "the rest of the story".
> 
> Thanks to all who took time to share opinions and suggestions,
> Carl
> 
> 
> 
> 
> 
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