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Subject:	Re: large parts falling off finished surface mount board assemblies
From:	Pete <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Pete <[log in to unmask]>
Date:	Tue, 20 Sep 2011 11:23:19 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (12 lines)

Interesting that you could also peel the solder off the leads.  Adds to the reflow process failure idea.

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