Hi Jack,

  final assembly ( or better, the EEE) must be RoHS compliant, by the way
the Directive 2002/95/EC RoHS, does not require any mark for that. 

The newest RoHS-2 (recast) Directive 2011/65/EU (starting by Jan 2th
2013)the CE Mark, together with documentation (material composition
declaration, etc) will tell if the EEE is Compliant with the new RoHS 2.

The IPC/J-STD-609A, explain very well why the marking is so important for
those who have to handle components with different lead plating (labelling
on reels or boxes) or board finishes, who have to Assembly or Rework PBA,
etc.

Etc....

Gabriele

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Jack Olson
Inviato: domenica 18 settembre 2011 17.20
A: [log in to unmask]
Oggetto: Re: [TN] standard industry silkscreened symbology for Pb-free
assembly

I agree, but I would also caution you to think about something.
When you mark something on a bare board as being "lead free",
are you telling the world that only the bare board is lead free?
...or are you implying that the final assembly is lead free?
Be cautious about marking a bare board, and then losing control of it later
on.

Maybe the assembler should be marking the final assembly as "compliant"?

Does anyone else have experience with this?
I'm nervous about stamping a bare board, and then someone later down the
line decides to assemble the board with different criteria...

Jack

.

On Fri, 16 Sep 2011 08:52:53 -0500, Kim Sterling <[log in to unmask]>
wrote:

>Hello Joe - Our tech staff recommends IPC/J-STD-609A, IPC/JEDEC Marking and
Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free
(Pb-Free) and Other Attributes. Written to cover this type of question.
www.ipc.org/609A<http://www.ipc.org/609A>.
>
>Hope that helps.
>
>Kim Sterling, IPC

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