As someone that assist PWB manufactures with failure analysis when they
have ENIG (as well as other finishes) issues, I can tell you with complete
confidence that a shop running ENIG in control will not have issues. A
shop that doesn't adhere to "best practice" process controls will create
ENIG issues. I have customers that have not had failures in several years
and I have some customers that seem to have issues monthly. The difference
between the two are process control. This is not rocket science
controlling ENIG. The manufacturer needs to adhere to straight forward
process controls. Something any manufacturer can do if they are willing to
follow instructions and conduct regular audits to insure compliance.
Regards,
Bob Metcalf
Western Regional Manager
Atotech USA Inc
1750 Overview Drive
Rock Hill, South Carolina 29730 USA
Mobile: 714-334-7667
e-mail: [log in to unmask]
Internet: www.atotech.com
Managing Director: Kuldip Johal
This e-mail and any attachments hereto are business documents of Atotech
USA Inc. and may contain CONFIDENTIAL OR PROPRIETARY BUSINESS INFORMATION.
Unauthorized disclosure and/or use of information contained in this
e-mail are prohibited. If you are not the intended recipient, you should
dispose of it and not use, disseminate or copy this message or any other
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From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Date: 09/15/2011 03:09 PM
Subject: Re: [TN] ENIG versus LFHASL
Sent by: TechNet <[log in to unmask]>
No, ENIG is still a daily pain in the rear. I am dealing with it (not at
GD) at different clients almost daily.
Although I am sure it has gotten much better as the board fabricators
learn more, and start getting their processes under control, which is the
key.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Thursday, September 15, 2011 4:28 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG versus LFHASL
no RF... and no bananas ...
the bad reputation of ENIG, does it not belong to history now? I used to
get ENIG issues on my desk once a week, but have not heard of any problems
for years. Probable cause is that they buy lots and that there is a
stringent quality/process control, not only in a bunch of papers,* but in
the daily routines.* Our purchaser or the component guy knows that he
can't
sit in his chair all day, but got to visit the board maker frequently. A
ticket to Shanghai or Tokyo or like costs less than a handful of PWBs.
Don't tell me that your company is a small one, then the reason for
personal
contacts is even more worthful. Standing still one week can be
catastrophic
for a small entrepeneur with only one source and only one product, while
a
mega one can redirigate to another plant in the country or abroad.
I've heard that american electronic engineers in general are little slow
when it comes to 'benchmarking' , but I do not know if it's true.
//Inge
On 15 September 2011 22:40, Phil Nutting <[log in to unmask]>
wrote:
> Ok, so we use SMT and PTH circuit boards, all are low speed (20 kHz to
50
> kHz), no BGAs, smallest parts are typically 0603, no Bluetooth, no RF,
> typically 0.015 pitch. Environment might be a medical office, airport,
> semiconductor fab or research lab.
>
> As for all the geniuses getting together to decide... I'm it. There is
no
> one else that has in depth knowledge of all the possible factors. I
guess
> I could go out to lunch and discuss it with myself over a couple of
> martinis. Yum!
>
> Phil
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
> Sent: Thursday, September 15, 2011 3:19 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> Regarding my previous post, I am not saying anyone should not use ENIG.
You
> just need to be knowledgeable in ALL surface finishes before you make a
> selection.
> Surface finish is not something you pull out of your hat based just on
> whether the CCA is going to be lead-free, although that is definitely
one of
> the factors.
> For example, you need to consider the type of circuitry. If it is an
> analog, high RF, Bluetooth CCA for example, ENIG would be your last
choice
> (it may be too lossy, and if you do not understand what that means you
> should not be determining the surface finish alone).
>
> If it is a double sided SMT CCA with BGAs on both sides, with
through-hole
> parts that require hand soldering, and must be processed using lead-free
> solder, why then, ENIG might just be the best choice. Or it might not.
In
> that case, OSP is definitely not the best choice.
>
> Selection of finish should be left to a team of engineers who know all
of
> the advantages/disadvantages of each finish and understands (intimately)
> his/her particular circuit design types (RF receiver/converter, digital
> processor card, power supply card, D/A card, thermoswitch device, etc,)
and
> there are many to consider. The designer, process engineer, and quality
> engineer should also be familiar with the fabrication capabilities (or
> conversely, the weaknesses) of the different fabricators they have a
> business relationship with, and have that in mind when selecting a
finish
> also.
>
> It is definitely NOT something a manufacturing engineer alone should
decide
> based solely on process type or "personal favorite".
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
> Sent: Thursday, September 15, 2011 1:37 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> In fact, Werner wrote entire papers about the possible problems with
using
> ENIG. Here are some;
>
http://content.yudu.com/Library/A1qwqg/GlobalSMTampPackagin/resources/61.htm
>
> http://www.trafalgar2.com/documents/Issue_Archive/global_7.3_us_opt.pdf
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Thursday, September 15, 2011 1:19 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> I am in favor of LFHASL because of its robust in processes and storage
> conditions. You just have to choose the right alloy in the HASL process.
>
> You can search in the IPC archive and read Werner recommendations, he
was
> favor of Immersion Silver and against ENIG because of the Ni3Sn4 IMC
layer,
> High thermal energy (15 degC) at reflow soldering, lnferior electrical
> properties of solder joints and other reasons such solder d black pads.
>
> Reuven
>
> On Thu, Sep 15, 2011 at 8:00 PM, Phil Nutting
<[log in to unmask]
> >wrote:
>
> > Hello Technetters,
> >
> > We are having a discussion about the merits of both ENIG and LFHASL.
> > In
> > 2006 when we switch to a RoHS compliant process we evaluated many
> > board finishes and decided, for our volumes, that although ENIG was
> > more expensive it was more robust. LFHASL wasn't ready for prime
> > time, Immersion Silver was great but required careful storage and
> > handling, OSP was not something that fit our process.
> >
> > Now that LFHASL appears to be more main stream we are reconsidering
it.
> > ENIG is not always done in-house at some of our fab shops, so that
> > adds time and money to the delivery. These shops now have LFHASL
> > in-house, so there is a potential for some savings here. We have been
> > given stories of storage issues with LFHASL and other concerns too.
> >
> > As I recall, the industry recommended method of storage of bare
> > circuit boards is in a sealed bag with desiccant, regardless of board
> finish.
> > Leaving bare boards unwrapped and in an open bin is just plain bad
> > practice especially if near the ocean.
> >
> > Several of us here think LFHASL is now right for our processes.
> >
> > Please advise if we are off base.
> >
> > Phil Nutting
> > Design for Manufacturing Engineer
> > Kaiser Systems, Inc.
> > 126 Sohier Road
> > Beverly, MA 01915
> > Phone: 978-922-9300 x1310
> > Fax: 978-922-8374
> > e-mail: [log in to unmask]<mailto:[log in to unmask]>
> > www.kaisersystems.com<http://www.kaisersystems.com>
> > www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting
> > >
> >
> >
> > ________________________________
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>
> --
>
> Best Regards,
>
> *Reuven Rokah*
>
> Mobile: 972-52-60-120-18
> Tele-fax: 97239360688
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