I also have ENIG failures for investigation BP and Nickel oxidation/wetting problems. But I just lately have immersion Silver tarnish issue right after the reflow process.
So every one have to use the right PCB shop and the right technology consultant.
Reuven
נשלח מה-iPhone שלי
ב-16 בספט 2011, בשעה 01:09, "Stadem, Richard D." <[log in to unmask]> כתב/ה:
> No, ENIG is still a daily pain in the rear. I am dealing with it (not at GD) at different clients almost daily.
> Although I am sure it has gotten much better as the board fabricators learn more, and start getting their processes under control, which is the key.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Thursday, September 15, 2011 4:28 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> no RF... and no bananas ...
>
> the bad reputation of ENIG, does it not belong to history now? I used to
> get ENIG issues on my desk once a week, but have not heard of any problems
> for years. Probable cause is that they buy lots and that there is a
> stringent quality/process control, not only in a bunch of papers,* but in
> the daily routines.* Our purchaser or the component guy knows that he can't
> sit in his chair all day, but got to visit the board maker frequently. A
> ticket to Shanghai or Tokyo or like costs less than a handful of PWBs.
> Don't tell me that your company is a small one, then the reason for personal
> contacts is even more worthful. Standing still one week can be catastrophic
> for a small entrepeneur with only one source and only one product, while a
> mega one can redirigate to another plant in the country or abroad.
>
> I've heard that american electronic engineers in general are little slow
> when it comes to 'benchmarking' , but I do not know if it's true.
>
> //Inge
>
>
> On 15 September 2011 22:40, Phil Nutting <[log in to unmask]> wrote:
>
>> Ok, so we use SMT and PTH circuit boards, all are low speed (20 kHz to 50
>> kHz), no BGAs, smallest parts are typically 0603, no Bluetooth, no RF,
>> typically 0.015 pitch. Environment might be a medical office, airport,
>> semiconductor fab or research lab.
>>
>> As for all the geniuses getting together to decide... I'm it. There is no
>> one else that has in depth knowledge of all the possible factors. I guess
>> I could go out to lunch and discuss it with myself over a couple of
>> martinis. Yum!
>>
>> Phil
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
>> Sent: Thursday, September 15, 2011 3:19 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG versus LFHASL
>>
>> Regarding my previous post, I am not saying anyone should not use ENIG. You
>> just need to be knowledgeable in ALL surface finishes before you make a
>> selection.
>> Surface finish is not something you pull out of your hat based just on
>> whether the CCA is going to be lead-free, although that is definitely one of
>> the factors.
>> For example, you need to consider the type of circuitry. If it is an
>> analog, high RF, Bluetooth CCA for example, ENIG would be your last choice
>> (it may be too lossy, and if you do not understand what that means you
>> should not be determining the surface finish alone).
>>
>> If it is a double sided SMT CCA with BGAs on both sides, with through-hole
>> parts that require hand soldering, and must be processed using lead-free
>> solder, why then, ENIG might just be the best choice. Or it might not. In
>> that case, OSP is definitely not the best choice.
>>
>> Selection of finish should be left to a team of engineers who know all of
>> the advantages/disadvantages of each finish and understands (intimately)
>> his/her particular circuit design types (RF receiver/converter, digital
>> processor card, power supply card, D/A card, thermoswitch device, etc,) and
>> there are many to consider. The designer, process engineer, and quality
>> engineer should also be familiar with the fabrication capabilities (or
>> conversely, the weaknesses) of the different fabricators they have a
>> business relationship with, and have that in mind when selecting a finish
>> also.
>>
>> It is definitely NOT something a manufacturing engineer alone should decide
>> based solely on process type or "personal favorite".
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
>> Sent: Thursday, September 15, 2011 1:37 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG versus LFHASL
>>
>> In fact, Werner wrote entire papers about the possible problems with using
>> ENIG. Here are some;
>> http://content.yudu.com/Library/A1qwqg/GlobalSMTampPackagin/resources/61.htm
>>
>> http://www.trafalgar2.com/documents/Issue_Archive/global_7.3_us_opt.pdf
>>
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
>> Sent: Thursday, September 15, 2011 1:19 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] ENIG versus LFHASL
>>
>> I am in favor of LFHASL because of its robust in processes and storage
>> conditions. You just have to choose the right alloy in the HASL process.
>>
>> You can search in the IPC archive and read Werner recommendations, he was
>> favor of Immersion Silver and against ENIG because of the Ni3Sn4 IMC layer,
>> High thermal energy (15 degC) at reflow soldering, lnferior electrical
>> properties of solder joints and other reasons such solder d black pads.
>>
>> Reuven
>>
>> On Thu, Sep 15, 2011 at 8:00 PM, Phil Nutting <[log in to unmask]
>>> wrote:
>>
>>> Hello Technetters,
>>>
>>> We are having a discussion about the merits of both ENIG and LFHASL.
>>> In
>>> 2006 when we switch to a RoHS compliant process we evaluated many
>>> board finishes and decided, for our volumes, that although ENIG was
>>> more expensive it was more robust. LFHASL wasn't ready for prime
>>> time, Immersion Silver was great but required careful storage and
>>> handling, OSP was not something that fit our process.
>>>
>>> Now that LFHASL appears to be more main stream we are reconsidering it.
>>> ENIG is not always done in-house at some of our fab shops, so that
>>> adds time and money to the delivery. These shops now have LFHASL
>>> in-house, so there is a potential for some savings here. We have been
>>> given stories of storage issues with LFHASL and other concerns too.
>>>
>>> As I recall, the industry recommended method of storage of bare
>>> circuit boards is in a sealed bag with desiccant, regardless of board
>> finish.
>>> Leaving bare boards unwrapped and in an open bin is just plain bad
>>> practice especially if near the ocean.
>>>
>>> Several of us here think LFHASL is now right for our processes.
>>>
>>> Please advise if we are off base.
>>>
>>> Phil Nutting
>>> Design for Manufacturing Engineer
>>> Kaiser Systems, Inc.
>>> 126 Sohier Road
>>> Beverly, MA 01915
>>> Phone: 978-922-9300 x1310
>>> Fax: 978-922-8374
>>> e-mail: [log in to unmask]<mailto:[log in to unmask]>
>>> www.kaisersystems.com<http://www.kaisersystems.com>
>>> www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting
>>>>
>>>
>>>
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>>
>> --
>>
>> Best Regards,
>>
>> *Reuven Rokah*
>>
>> Mobile: 972-52-60-120-18
>> Tele-fax: 97239360688
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