Triboelectrics can't be described by Mbz1.x (magnetic model), Mott diagram,
Monte Carlo etc. How did this appear in a LFHASL question? On the other hand
> User talk:Mbz1/Archives/2010User talk:Mbz1/Archives/2010 < also a worm, be
careful.
Inge
On 15 September 2011 21:52, Stadem, Richard D. <[log in to unmask]> wrote:
> What Mbz1.x?!! Only a two-headed xenomorgal from Mak'al'eno would say that.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Frederick Miller
> Sent: Thursday, September 15, 2011 2:39 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> Mbz1.x
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
> Sent: Thursday, September 15, 2011 2:19 PM
> To: [log in to unmask]
> Subject: Re: [TN] ENIG versus LFHASL
>
> I am in favor of LFHASL because of its robust in processes and storage
> conditions. You just have to choose the right alloy in the HASL process.
>
> You can search in the IPC archive and read Werner recommendations, he
> was
> favor of Immersion Silver and against ENIG because of the Ni3Sn4 IMC
> layer,
> High thermal energy (15 degC) at reflow soldering, lnferior electrical
> properties of solder joints and other reasons such solder d black pads.
>
> Reuven
>
> On Thu, Sep 15, 2011 at 8:00 PM, Phil Nutting
> <[log in to unmask]>wrote:
>
> > Hello Technetters,
> >
> > We are having a discussion about the merits of both ENIG and LFHASL.
> In
> > 2006 when we switch to a RoHS compliant process we evaluated many
> board
> > finishes and decided, for our volumes, that although ENIG was more
> expensive
> > it was more robust. LFHASL wasn't ready for prime time, Immersion
> Silver
> > was great but required careful storage and handling, OSP was not
> something
> > that fit our process.
> >
> > Now that LFHASL appears to be more main stream we are reconsidering
> it.
> > ENIG is not always done in-house at some of our fab shops, so that
> adds
> > time and money to the delivery. These shops now have LFHASL in-house,
> so
> > there is a potential for some savings here. We have been given
> stories of
> > storage issues with LFHASL and other concerns too.
> >
> > As I recall, the industry recommended method of storage of bare
> circuit
> > boards is in a sealed bag with desiccant, regardless of board finish.
> > Leaving bare boards unwrapped and in an open bin is just plain bad
> practice
> > especially if near the ocean.
> >
> > Several of us here think LFHASL is now right for our processes.
> >
> > Please advise if we are off base.
> >
> > Phil Nutting
> > Design for Manufacturing Engineer
> > Kaiser Systems, Inc.
> > 126 Sohier Road
> > Beverly, MA 01915
> > Phone: 978-922-9300 x1310
> > Fax: 978-922-8374
> > e-mail: [log in to unmask]<mailto:[log in to unmask]>
> > www.kaisersystems.com<http://www.kaisersystems.com>
> >
> www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting>
> >
> >
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