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September 2011

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 14 Sep 2011 20:46:10 -0400
Content-Type:
text/plain
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text/plain (77 lines)
Cedric,
In some rather rare cases fluxes of different types (core wire vs. solder
paste, wave flux vs. solder paste, etc.) when mixed together fail SIR and/or
electrochemical migration testing, even though they individually pass.  I
can't prove it, but I would expect that a failure would be more likely to
happen if the two materials are not made by the same supplier.

That being said, even large companies like Nortel (now deceased  :( ) did
NOT test ever combo, not even 10% of the combinations, because, frankly, it
would be too costly and the risk was deemed low enough to live with the
possibility.

So there is some risk, but as far as I know, no one in our industry has ever
quantified what that risk is.

Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cedric ORAIN
Sent: Wednesday, September 14, 2011 3:10 AM
To: [log in to unmask]
Subject: [TN] Flux Compatibility

Good morning dear Technetters,

I'm asked by one of my customer if I checked the compatibility between in
one hand the no-clean flux from the SMD paste and the other hand the resin
flux from the wires.

The answser was no !

Could you advise which kind of issue could occur if any ?

Thanks for your help,

Regards,

Cedric
www.inovelec-groupe.com




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