Dear Shirley:

        IPC-9708应该会对您有所帮助，以下信息供您参考，该标准目前还没有中文版。

IPC-9708<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=96fe9da8-8f07-e011-95c7-002219545fd5>

Test Methods for Characterization of Printed Board Assembly Pad Cratering



Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.



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Thank you & Best regards

NEW：10月成都/11月武汉/12月深圳

IPC2011年“热魔”杯手工焊接竞赛各分赛区期待您的参与！

绑定微薄，将IPC资讯分享进行到底！

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Paul Zong  宗云龙

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IPC China

选择IPC标准，说明您对产品是认真的！

IPC中文培训官网：http://www.ipc.org.cn/Training-Certification/index.html



发件人: TGAsia [mailto:[log in to unmask]] 代表 Wen, Shirley

发送时间: 2011年9月6日 11:56

收件人: TGAsia

主题: [TGAsia] pad cratering test



Hi members:

   谁有做过Pad cratering 测试？有没有中文测试方法啊？谢谢



Best Regards



Shirley.Wen

Reliability Lab

Tel:0752-2617251



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