可以参考JEDEC/IPC-JP002 《最新锡晶须原理及减缓方法指南》
Best Regards,
James Liu 刘春光
Director, IPC China Training Centers/Technology 培训中心主任/技术总监
IPC China
北京市经济技术开发区荣华中路15号朝林大厦B05
Room B05, Zhaolin Building, #15 Ronghua Zhong Road, BDA 100176 Beijing China
Tel: +86 10 67885326
Fax: +86 10 67885326
MP: +86 136 0133 3491
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www.ipc.org.cn<http://www.ipc.org.cn/>
IPC中文培训官网：http://www.ipc.org.cn/Training-Certification/index.html
NEW：2011年10月成都/11月武汉/12月深圳
IPC2011年“热魔”杯手工焊接竞赛各分赛区期待您的参与！
IPC围脖，实时报道IPC中国动态，欢迎加好友！
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[cid:[log in to unmask]]
发件人: TGAsia [mailto:[log in to unmask]] 代表 Eileen Xiang
发送时间: 2011年9月19日 11:13
收件人: TGAsia
主题: Re: [TGAsia] BGA空焊点短路原因
很好的照片，好象是枝晶生长之后造成的不良。
From: TGAsia [mailto:[log in to unmask]]<mailto:[mailto:[log in to unmask]]> On Behalf Of ??
Sent: Monday, September 19, 2011 11:09 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TGAsia] BGA空焊点短路原因
各位专家好
我司出现如下图的BGA空焊盘短路，此空焊盘区域有用环氧树脂封，产品在客户端使用2个多月后出现此不良，请教各位专家有什么见解
[cid:[log in to unmask]]
刘 兵
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