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September 2011

TGAsia@IPC.ORG
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Subject:
元件焊接温度
From:
Dhl <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Dhl <[log in to unmask]>
Date:
Fri, 16 Sep 2011 22:18:57 +0800
Content-Type:
text/plain
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text/plain (1 lines) 
各位专家，我们遇到一个问题：

有颗SMD半导体元件,datasheet指出焊接温度最高260度，但是我们过焊锡炉温度在260度左右，容易造成伤害，现在面临两个困难，一，客户要求成品需更换此元件，但是烙铁很难保证焊接温度不超过上限，用260很难熔锡，基本上是冷焊，有什么好方法。二，长期我们考虑改为reflow制程解决此问题。
请大家对第一个问题发表建议，谢谢！

Edmund

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