We've recently discovered solder touching the body of inward formed L-shaped ribbon lead components, specifically diodes of DO-214AA, DO-214AB and DO-214AC flavors.  I'm reviewing our customers pad designs and the stencil designs now.  Most pad designs are significantly larger than the leads and stencil designs are 1:1 with the pads.  

We are using Sn63Pb solder paste with ORH1 flux.  PWB finishes are ENIG and HASL.    

I can revise the stencil designs to limit solder paste volume available, but I'm concerned we may have solder flow over entire pad and end up with insufficient fillet height.  Does anyone have experience with this approach?  

Dick Krug, SSBB, CSMTPE
SMT Process Engineer
Sparton Corporation
30167 Power Line Road
Brooksville, FL  34602-8299
p (352) 540-4012  (Internal Ext. 2012)
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