TECHNET Archives

August 2011

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Woolley, Mark D. (Mark)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Woolley, Mark D. (Mark)
Date:
Tue, 9 Aug 2011 16:18:48 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
I have a question now that our company is beginning to use lead free
HASL as a solderability finish.  I am seeing a few (<5%) filled vias on
each board I examine.  Does anyone know if the manufacturer's are using
pure tin, and if they are has anyone looked at tin whiskers from HASL
filled vias?

Thanks,
mark


mark
Mark Woolley |PTRL Laboratory | Avaya | 1300 West 120th Ave |
Westminster, CO 80234  USA |
Voice (Lab): (303) 538-2166 | email: [log in to unmask] |


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2