Thanks, I wanted to hear how others are doing it, only thing different we are doing is using 10 mil via, and that should be less of a problem than 12, and we are not connecting all layers to the vias, just  the back side.

Dave - yes, that is the main point we are now debating, to cap the vias or not with soldermask. By cap I mean put a layer of soldermask just slightly bigger than via hole, then the "normal" layer of solder mask, to the bottom side only of course.
as for filling them, we really want to avoid that.


Perhaps our real problem is being too conservative (small via, we are only using 5 where the design engineers estimate is 6-8, and not connecting inner same net planes) will prevent enough heat transfer, the whole point of the slug, right?

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