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August 2011

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Subject:
From:
Don McFarland <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Don McFarland <[log in to unmask]>
Date:
Wed, 3 Aug 2011 11:49:31 -0600
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Any ideas on methods to remove a tin chloride residue that was found on a FR-4 substrate after wave solder. We have done some good homework to find the source, but we are looking for good and proven methods to remove the residues from affected assemblies.

Any input is welcome. 

Regards, 

Don McFarland

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