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August 2011

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Subject:
From:
Larry Dzaugis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Larry Dzaugis <[log in to unmask]>
Date:
Wed, 24 Aug 2011 13:13:55 -0500
Content-Type:
text/plain
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text/plain (37 lines)
Simply wiping the PCB clean will result in solder balls in the vias that
will come out to play when you go through re flow.

Equipment similar to a stencil cleaner is used. They come in all shapes and
sizes and methods of cleaning and chemistry. It depends on your
assemblies and what they are used for. The PCB must be dry before it goes
back into production. Don't contaminate the board wth dirty cleaning
solution. This is for bare boards.
Boards populated on one side with a mis print have more conditions. My lines
run no clean flux, as a result no one pays attention if the part is not
sealed. Many inductors on my assemblies have dust caps that would fill up
with cleaning solution and not drain. Therefore the boards are scrapped for
misprints with bridges. PCA's with missing solder or insufficient solder are
reprinted. I was not able to justify the purchase of any significant
equipment due to the total value of scrapped mis printed PCB's.
It was better to scrap.

Populated boards can be cleaned to remove the solder paste.
The type of components, size, customer requirements will determine what you
can use.


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