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August 2011

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 24 Aug 2011 12:14:22 -0500
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text/plain (341 lines)
I agree, Dewey. I have always envisioned you out there, standing by a manure spreader. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey (EHCOE)
Sent: Wednesday, August 24, 2011 11:15 AM
To: [log in to unmask]
Subject: Re: [TN] NTC:LinkedIN

Oh! I see the light. With the "virtual farm", I could add myself. I've
always wanted to be known as a man outstanding in his field.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Wednesday, August 24, 2011 8:38 AM
To: [log in to unmask]
Subject: Re: [TN] NTC:LinkedIN

Steve,

Absolutely correct!  You get out of it what you put in.  For connecting
with past friends, I can see where FB would be very convenient.

I was alluding to the activities that it offers like a virtual 'farm',
etc.  I would rather be outside working than that..

Like anything else, it can be used 'properly', or 'abused' - subject to
one's own interpretation

Best wishes

Steve C

-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]] 
Sent: Wednesday, August 24, 2011 11:18 AM
To: 'TechNet E-Mail Forum'; 'Steven Creswick'
Subject: RE: [TN] NTC:LinkedIN

Hi Steve,

I agree with you completely about LinkedIn. I am also a FB'er, and it's
strictly social, I must say for me it's been pretty cool. 

I've been able to hook-up with my Navy shipmates from my old squadrons
who I flew with over 30 years ago, and even have a reunion in the
planning stages in Pensacola, Florida next year. Don't think that ever
would have had happened without Facebook. Well it might have, but not
without a whole lot of work.

I guess it all depends what you want to get out of it, if you think it's
bothersome, then you won't find any use for it. I think being able to
communicate with old friends across the country and the world at the
speed of light for free is pretty cool...

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Wednesday, August 24, 2011 10:53 AM
To: [log in to unmask]
Subject: Re: [TN] NTC:LinkedIN

Ben,

In many respects LinkedIn Groups and IPC Tech Forums are quite similar,
although they likely service differing disciplines, or areas of
interest.

I cannot speak for Facebook, because I don't 'do it'.  [My wife does
occasionally, and seems a too bit much 'social' media chit chat for me.]

Not that TechNet or LinkedIn is totally devoid of misc chit chat, etc,
but Facebook seems to me to be >95% chit chat.

I became involved in TechNet, when the FlipChip IPC forum was still
alive.  TechNet offered contact with individuals doing similar, or
obliquely similar processes, using similar materials.  That distinction
has blurred significantly over the years.

My primary interest [as Inge knows] over the years has always been in
the hybrid microelectronics realm - simply explained as 'putting
together that which you stuff on your boards' - at least one layer of
packaging below yours.  Microelectronics present challenges which many
people are simply not aware of.  People like Joyce and Inge, with
wirebonding experience can relate.

In the olden-days, it was more often called Hybrid Microelectronics
because it really was a "hybrid" - combining desirable characteristics
from many different technologies [substrate - thin film, thick film,
HTCC, LTCC, flex, laminate, glass, etc[; from many different
metallization technologies [plating, thick film, thin film direct write,
polymeric, etc.]; and offering many ranges of packaging technologies
[optical, hermetic, non-hermetic, chip on board, chip on flex, chip on
glass, glob top, ... etc.].  Those who best nurtured that
'hybridization', typically enjoyed the challenges. 

The areas where I can contribute on TechNet are primarily in the wire
bonding, platings for bonding [which sometimes offer certain
similarities to platings for solderable surface finishes], and device
packaging.  I have done the hands-on processing & manufacturing work for
SMD and Flip Chip assembly for low cost commercial telecommunications
devices as well as the upper end items that we don't speak about, and
others that reside within someone's chest, the International Space
Station's docking motor systems, or even are on the Cassini spacecraft,
still in the Saturnian system.

Now then, LinkedIn has specific groups for Wire Bonding, Device
Assembly, etc.  And, the links appear to keep growing.  Therefore, there
is a wealth of information exchange and growth taking place there, just
as there is on TechNet.  You just may not see it - nor care about it
:-) 

But, being the 'modern man' and continuing to learn and grow, it is
mind-widening to continue to open myself to other disciplines and
knowledge [which TechNet offers].  I continue with the 'hybridization'
mindset that I've always had - learning about those seemingly unrelated
materials, processes, and problems and applying them, as applicable, to
my needs and applications - or offering what appears to be appropriate
comment, on occasion.

Finally, LinkedIn is supposedly viewed more often [certainly than
TechNet] by the HR types.  So, if one is like me, over 50,
over-experienced, and looking for a job in my own locality, LinkedIn is
a reasonable forum to participate in.

By leaving the LinkedIn link on my 'signature' I do not 'brag', I do not
twist anyone's arm to 'link-in' etc, however, it is an extension of my
hand[shake] should anyone wish to link.

I enjoy both TechNet AND LinkedIn because of the learning and
contributing experience offered by both.  There is nothing that says we
have to belong to ANY media group, and the last time I checked, most of
us were still free to select which one/s we desired to belong to.  

So, do your own thing... as others have already stated.   I am  :-)


Steve Creswick
http://www.linkedin.com/in/stevencreswick








-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, August 24, 2011 6:58 AM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: Re: [TN] NTC:LinkedIN

Brian,

You may not be on LinkedIN or Facebook, but you've been on TechNet for a
while. The interface may not be as fancy, but it's basically the same
thing. (Albeit with less social and more technical.)

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Wednesday, August 24, 2011 3:20 AM
To: [log in to unmask]
Subject: EXTERNAL: Re: [TN] NTC:LinkedIN

Inge

I have neither friends nor am a friend of anyone. I have refused to 
participate in any so-called social networks from the word go-get. I may

be missing something but I'll take that risk. Your 'friendship web' will

therefore always be missing one person!

Maybe we should have a network for anti-networkers :-D

Brian

On 24/08/2011 09:26, Inge wrote:
> Hi,
> well, I suppose that most of you are 'linked' to someone who is linked
> to someone who is linked...
> Interesting. I have friends who have up to 5,000 friends, and the
> linking and Facebooking avalanche goes on. Now, what will happen when
we
> are linked together, either by means of LinkedIn, Facebook or other
> accumulation program? This is probably only the start of a gigantic
> 'friendship web'. Kind of a computer world's parallel to the 60's
Flower
> power. One of my sons spend at least 1-5 hs a day chatting with his
565
> friends from all places on this planet. It's a fantastic world that
> opens wth just a mouse in your hand, but how will we play our roles in
> the future and what will be the fruitbringng results? Anyone with a
> crystal bal?
>
> /Inge
>
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