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Date: | Tue, 23 Aug 2011 12:50:19 -0500 |
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IPC Midwest, September 21-22, 2011, is returning to the Renaissance Schaumburg Hotel & Convention Center in convenient Schaumburg, Ill. Register today for FREE exhibit hall admission http://www.IPCMidwestShow.org/register
Hurry! Special hotel rate expires August 29 http://www.IPCMidwestShow.org/hotel
Technical conference paper topics:
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
Developing a Counterfeit Testing Program
Cleanliness Comparison - C3 Localized Versus Total Board Extractions
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Cleaning Challenges in an HDI World
Common Mistakes in Electronic Design
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
Evolution Toward a Workmanship Standard for Underfill
Design and Process Implementation Principles for Embedded Components
Thermal Pad Design at QFN Assembly for Voiding Control
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
Low-Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low-Silver Solder Alloys
How to Manage Wave Solder Alloy Contaminations
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Quantitatively Predicting the Reliability of Complex Integrated Circuits
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
For details on all IPC Midwest activities, visit http://www.IPCMidwestShow.org
Gayle Pervos
Marketing Coordinator
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Dr. Ste 309S
Bannockburn, IL 60015-1249 USA
+ 1 847-597-2829 tel
+ 1 847-615-5629 fax
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.IPC.org>
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