If you do wirebonding yourself and show the gold is acceptable with pull strength meet the MIL-STD, or with the agreed strength with your customer, it should be OK. If your contract only specify thickness and hardness, but not wirebonding pull strength, you are out of spec, you need a waver for non compliance.
My 2 cents.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Noel, William J - GS
Sent: Tuesday, August 23, 2011 12:29 PM
To: [log in to unmask]
Subject: [TN] Gold / Nickel Plating
Hello all -
We have some flexes that were designed for a wire bonding application and the finish in the wirebonding area was specified on the fabrication drawing as follows:
BOND PAD AREAS, AS DEFINED BY THE EXPOSED COPPER AREA, SHALL BE PLATED AS FOLLOWS: 30 - 100 MICROINCHES OF SOFT GOLD PER
MIL-G-45204, TYPE III, GRADE A OVER 200 -100/+250 MICROINCHES OF SOFT NICKEL PER MIL-P-27418. (SULFAMATE BATH) GOLD PLATING
UNDER THE OUTER LAYER LAMINATE IS ALLOWED TO A MAXIMUM OF .050
Upon inspection, we are finding samples that exceed the maximums in the area of 400-500 microinches of gold and 500-600 microinches of nickel. We are wondering if these would still be acceptable for our wirebonding application. Any help? Thanks in advance.
Bill Noel
ITT
Geospatial Systems Division
400 Initiative Drive
Rochester, New York 14606-0488
P: (585) 269-5911
F: (585) 672-8042
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