Hello Inge, I would also like a copy of the graph. Gerry
 > Date: Mon, 22 Aug 2011 20:03:55 +0200
> From: [log in to unmask]
> Subject: Re: [TN] ENIG Variation Reliability
> To: [log in to unmask]
> 
> Don, it's not a q about thickness, but rather the P% during the process.
> I'll send to you a graph that points at the possibility of failure for a
> ENIG process. The P% should be 6-11% for a handable process window.
> /Inge
> 
> On 18 August 2011 22:21, Don McFarland <[log in to unmask]> wrote:
> 
> > I have an issue with a recent batch of bare boards with an ENIG finish. The
> > mean Au reading on XRF is 1.6 u" and the NiP mean value is 300u". I'm not
> > too worried about the Au, based on the great study in 4552, but i am not
> > sure about the potential issues associated with the high NiP values.
> >
> > Any help would be appreciated.
> >
> > Don
> >
> > PS. Measurement systems and methods have been confirmed...its a legit spec
> > issue and not measurement error.
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