Hi, Rich
I don't know about any papers on the subject, but from my own personal experience with mold release materials, whether silicone or lecithin based, both present a real challenge to completely remove such that conformal coating and epoxies can bond to the intended surface. Not even an alcohol bath/scrubbing will remove all of the mold release agents in some cases. I have had to come to an understanding with the customer that for certain components with potted or plastic bodies, it may be permissible to have some coating dewetting, as long as there was no excessive peeling. The coating is not really needed on those parts of the components anyway, you want to make sure all of the metal solder joints and metal conductors are covered.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Monday, August 15, 2011 10:33 AM
To: [log in to unmask]
Subject: [TN] One of the elephants in the coating room/area ....

IPC J Std-001 indicates in section 10.1.2.2 that unless ABUS,
essentially all components need to be coated with no dewetting or pull
back.  This is normally not an issue until you get that few lots of
plastic components that have some Si release agent on them. Most well
versed in coating are well aware this transient phantom and associated
grief. 

Is anyone aware of any industry specification or supplier FAQ, white
paper, etc. that speaks about the challenges that release agents
occasionally pose to coating ?

Thanks in advance

Rich Kraszewski/ Plexus  



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