TGASIA Archives

August 2011

TGAsia@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: 答复: 什么原因导致PCB板过re-flow后金PAD起泡？ 已经排除是湿气受潮的原因
From:
刘勇 <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, 刘勇 <[log in to unmask]>
Date:
Fri, 26 Aug 2011 06:11:30 +0000
Content-Type:
multipart/related
Parts/Attachments:
text/plain (34 kB) , text/html (10 kB) , image001.jpg (34 kB)

ATOM RSS1 RSS2