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August 2011

TGAsia@IPC.ORG

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Asia Committe Task Group Forum <[log in to unmask]>, Rocky Wang <[log in to unmask]>
Date:
Thu, 11 Aug 2011 16:21:13 +0800
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Asia Committe Task Group Forum <[log in to unmask]>, Tiger ZHANG <[log in to unmask]>
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Tiger ZHANG <[log in to unmask]>
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Hi Rocky,

我们倒是有很多供应商,可以做到20层以上,这取决于你的量。
具体你可以发邮件给我:[log in to unmask]
BR//Tiger






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-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Rocky Wang
Sent: Thursday, August 11, 2011 4:14 PM
To: [log in to unmask]
Subject: [TGAsia] PCB 设计

大家下午好:
    现在公司有个产品(6layers),现有的PCB供应商似乎做起来有些困难.
    1. BGA Via design 8*13.5mil (via and Pad),BGA pitch:0.65mm
    2. 3.5mil for Trace/Space, and 1HOZ copper foil is used for inner layer
    基于成本及PCB可制造性考虑, 大家有什么建议呢?

    另外询问大家所接触的PCB供应商有哪些,相对来说制造能力要强一些的.

Best Regards
Rocky

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