大家下午好:
现在公司有个产品(6layers),现有的PCB供应商似乎做起来有些困难.
1. BGA Via design 8*13.5mil (via and Pad),BGA pitch:0.65mm
2. 3.5mil for Trace/Space, and 1HOZ copper foil is used for inner layer
基于成本及PCB可制造性考虑, 大家有什么建议呢?
另外询问大家所接触的PCB供应商有哪些,相对来说制造能力要强一些的.
Best Regards
Rocky
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