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August 2011

TGAsia@IPC.ORG
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TGAsia <[log in to unmask]>
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TGAsia <[log in to unmask]>, woaini888 <[log in to unmask]>
Date:
Wed, 10 Aug 2011 20:08:53 -0500
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, "Leesha \"Lixia\" PENG" <[log in to unmask]>
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<[log in to unmask]>
Subject:
Re: 贴片过波峰焊后不上锡
From:
"Leesha \"Lixia\" PENG" <[log in to unmask]>
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Paul,

能查到



Leesha Peng

彭丽霞

IPC中国总经理

18616593891





在 2011-8-11，上午9:02，"woaini888" <[log in to unmask]<mailto:[log in to unmask]>> 写道：



你这板很好焊啊，给我电话啊13924605925



在 2011-08-10 23:39:04，"代华" <[log in to unmask]<mailto:[log in to unmask]>> 写道：

各位前辈：

      我公司最近生产的一款电子产品在波峰焊接的过程中贴片电阻一端不上锡，请问是波峰焊没有调好还是设计不到位？

      如果是波峰焊没有调好，请问波峰焊的参数该怎么设置？

      如果是设计的问题，请问贴片应该怎么调整位置？ 谢谢了！非常感谢！











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