TGASIA Archives

August 2011

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, wuhao <[log in to unmask]>
Date:
Tue, 30 Aug 2011 12:00:19 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, eagle <[log in to unmask]>
Subject:
答复: [TGAsia] PCB PAD Dewetting issue
From:
eagle <[log in to unmask]>
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<[log in to unmask]>
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