TGASIA Archives

August 2011

TGAsia@IPC.ORG
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Sender:
TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 26 Aug 2011 11:58:40 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, eagle <[log in to unmask]>
Subject:
答复: [TGAsia] 什么原因导致PCB板过re-flow后金PAD起泡？ 已经排除是湿气受潮的原因
From:
eagle <[log in to unmask]>
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