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August 2011

TGAsia@IPC.ORG
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TGAsia <[log in to unmask]>
X-To:
Asia Committe Task Group Forum <[log in to unmask]>, "[log in to unmask]" <[log in to unmask]>
Date:
Fri, 26 Aug 2011 03:51:56 +0000
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, "Zou, Andrew" <[log in to unmask]>
Subject:
答复: 什么原因导致PCB板过re-flow后金PAD起泡？ 已经排除是湿气受潮的原因
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"Zou, Andrew" <[log in to unmask]>
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