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August 2011

TGAsia@IPC.ORG
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Date:
Fri, 26 Aug 2011 11:17:18 +0800
Reply-To:
Asia Committe Task Group Forum <[log in to unmask]>, [log in to unmask]
Subject:
什么原因导致PCB板过re-flow后金PAD起泡？ 已经排除是湿气受潮的原因
From:
Snow Fu <[log in to unmask]>
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TGAsia <[log in to unmask]>
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