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July 2011

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Subject:
From:
Gregg Owens <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gregg Owens <[log in to unmask]>
Date:
Mon, 11 Jul 2011 16:30:46 -0700
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text/plain
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Evamaria:

The J-STD-001 and the IPC-A620 are intended to always have the same process/quality requirements. The newer solder coverage requirements involve several different perspectives as follows:

Minimum Wrap Area: Solder fillet cover 75% of the required wrap (100% if wrap less than 90 degrees)
Minimum Wetted Height: 75% of the Wire Diameter (D)
Wetted Fillet: 50% of the Wire Diameter

This means solder must as a minimum WET up 75%D but the solder fillet may undercut the wire but must have a FILLET 50%D up the sides of the wire. I hope this explanation clarifies the intent of the requirements. 

Gregg Owens | Sr. Technical Writer
Wavestream Corporation
 (909) 599-9080 x 484 | [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Evamaria Jones
Sent: Monday, July 11, 2011 1:52 PM
To: [log in to unmask]
Subject: [TN] J-STD-001E 5.5 and IPC-A-620A 4.9 Terminal Soldering

I am confused. Is there a conflict between soldering to terminals requirement in 620A and J-STDE? I thought  I understood the concept of height (climb on wire) of solder.  Unfortunately, I can not interpret the depression percentages.

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