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July 2011

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Mon, 11 Jul 2011 09:50:45 -0500
Content-Type:
text/plain
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text/plain (154 lines)
Assuming you paste your vias...
How many people do that?


.
On Mon, Jul 11, 2011 at 9:41 AM, Wenger, George M. <
[log in to unmask]> wrote:

> Jack,
>
> If you use fluxes and solder pastes that are compliant to the Telcordia
> GR-78_CORE Generic Requirements for the Physical Design and Manufacture of
> Telecommunications Products and Equipment you should see any creeping crud
> growth on ImAg or OSP assemblies.
>
> Regards,
> George
> George M. Wenger
> Senior Principal Reliability / FMA Engineer
> Andrew Corporation - Wireless Network Solutions
> 40 Technology Drive, Warren, NJ 07059
> (908) 546-4531 Office (732) 309-8964 Mobile
> E-mail: [log in to unmask]
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
> Sent: Monday, July 11, 2011 10:18 AM
> To: [log in to unmask]
> Subject: Re: [TN] Leaded or non
>
> I would have said that too, until I started seeing pictures of the creeping
> crud growth on ImAg vias in older assemblies.
> (which we use for test points, so they are exposed) How do you get around
> that? Do you paste screen your vias? or conformal coat by default after ICT?
>
> Jack
>
> On Thu, 7 Jul 2011 14:26:16 -0500, David D. Hillman <
> [log in to unmask]> wrote:
>
> >Hi Steve - my vote would be the ImAg and lead-free assembly choice. All
> >three of your options should work with each having both pluses and
> >minuses. My preference is to solder to copper rather than nickel if given
> >a choice.
> >
> >Dave Hillman
> >Rockwell Collins
> >[log in to unmask]
> >
> >
> >
> >Steven Kelly <[log in to unmask]>
> >Sent by: TechNet <[log in to unmask]>
> >07/07/2011 12:56 PM
> >Please respond to
> >TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> >Steven Kelly <[log in to unmask]>
> >
> >
> >To
> ><[log in to unmask]>
> >cc
> >
> >Subject
> >[TN] Leaded or non
> >
> >
> >
> >
> >
> >
> >Hi All,
> >I have an 18 layer rigid flex (buried and blind)  that we are preparing to
> >put the surface finish on and then assemble.
> >Lots of BGA's etc.
> >The BGA's are lead free.
> >Options:
> >
> >1)      ENIG and lead free assembly
> >
> >2)      Immersion silver and lead free assembly
> >
> >3)      HASL and leaded assembly
> >Hi end military product.
> >
> >Thoughts or comments would be appreciated.
> >Thanks. Steve Kelly
> >
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