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July 2011

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Subject:
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Fri, 8 Jul 2011 14:36:48 +0800
Content-Type:
text/plain
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text/plain (95 lines)
If the BGAs are leaded I'll go for option (3), if not, I'll go for
option (2).
Process PCBA at suitable "lower" temperature is "safer" than at the
higher temperature.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Grunde Gjertsen
Sent: Friday, 8 July 2011 1:17 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

If the BGA's are leadfree you are stuck with a leadfree solder process,
if the customer insists on a SnPB process they must be reballed which
opens up another can of worms.
Another option is leadfree hasl and leadfree process but I wouldn't do
that if there is fine pitch SMD or uBGA's.

Given the choice between the three I'd go for 2, but how does ImmAG
stand up to bake out necessary on the Rigid flex board. Anybody knows?

Best regards
Grunde


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: 7.juli 2011 19:56
To: [log in to unmask]
Subject: [TN] Leaded or non

Hi All,
I have an 18 layer rigid flex (buried and blind)  that we are preparing
to put the surface finish on and then assemble.
Lots of BGA's etc.
The BGA's are lead free.
Options:

1)      ENIG and lead free assembly

2)      Immersion silver and lead free assembly

3)      HASL and leaded assembly
Hi end military product.

Thoughts or comments would be appreciated.
Thanks. Steve Kelly

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