If it’s a hi end military product, how is lead-free acceptable? Can you re-ball to SnPb balls?.....if not,i would go with ImmAg and LF


Amol Kane | Process Engineer
Catalyst Manufacturing Services, Inc.
941 Route 38, Owego NY 13827
Phone: (607) 687-7669 Extn 349 | Website: www.catalystems.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Thursday, July 07, 2011 3:40 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded or non

If the BGAs are lead free, you should process the lead free technology.
What about the HASL leaf free?

Best regards

Reuven 


ROKAH Technologies
The PCB & PCBA chief
Mobile: 972-52-6012018
Mail: [log in to unmask]


ב-7 ביול 2011, בשעה 20:56, Steven Kelly <[log in to unmask]> כתב/ה:

> Hi All,
> I have an 18 layer rigid flex (buried and blind)  that we are preparing to put the surface finish on and then assemble.
> Lots of BGA's etc.
> The BGA's are lead free.
> Options:
> 
> 1)      ENIG and lead free assembly
> 
> 2)      Immersion silver and lead free assembly
> 
> 3)      HASL and leaded assembly
> Hi end military product.
> 
> Thoughts or comments would be appreciated.
> Thanks. Steve Kelly
> 
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