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July 2011

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Subject:
Re: BGA ball dewet from substrate
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 1 Jul 2011 07:09:27 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines) 
Can it be BGA substrate clogged stencil?   I don't see any form of solder paste residue on the BGA substrate pad.

"X"

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Friday, July 01, 2011 6:59 AM
To: [log in to unmask]
Subject: Re: [TN] BGA ball dewet from substrate

Good Morning Julie,

I have your picture posted here:

http://stevezeva.homestead.com/Solder_dewet.jpg


That is pretty strange. I have never seen something like that!

Steve

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Thursday, June 30, 2011 8:47 PM
To: [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [TN] BGA ball dewet from substrate

Thank you!  Here it is, Steve.


--------------------------------
Julie Silk
Environmental Compliance Technical Program Manager Agilent Technologies
707-577-4296
[log in to unmask]

-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Thursday, June 30, 2011 5:34 PM
To: TechNet E-Mail Forum; SILK,JULIE (A-Sonoma,ex1)
Cc: Steve Gregory
Subject: RE: [TN] BGA ball dewet from substrate

Julie,

You can send your photograph to Steve Gregory who I've copied and he can post it on his site that is available to all the IPC TN members

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer Andrew Corporation - Wireless Network Solutions 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Thursday, June 30, 2011 6:29 PM
To: [log in to unmask]
Subject: Re: [TN] BGA ball dewet from substrate

The substrate pad shows an intermetallic layer, demonstrating that there had been a metallurgical bond.  Also, the surface of both pad and ball are smooth -- not a fracture, but as if reflowed.  I have a good picture from the FA report to share once I figure out how.  I believe that if you were to analyze the very first layer on the BGA substrate pad, it would have a layer of solder.

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