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July 2011

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Fri, 29 Jul 2011 20:06:13 +0200
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excellent. Al oxidizes and is used as gaskets in UHVS.
Inge


----- Original Message ----- 
From: "Kenneth J. Wood" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, July 29, 2011 7:40 PM
Subject: Re: [TN] High Vacuum Substrate


> thanks all...what if I use an aluminum substrate with a ceramic coating?
> Ken
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Friday, July 29, 2011 1:33 PM
> To: [log in to unmask]
> Subject: Re: [TN] High Vacuum Substrate
>
> Ken,
> you can't use organic substrates at 10exp-12 mBar. Use ceramic substrates.
> The organic binder in RO3003 never  stops outgassing.
> . A typical Pyrex glass system may need as much as +400 Centigrade baking
> and one week pumping to achieve 10exp-14, as a comparison.
> All depends on the volume and the gaskets etc. (Maissel & Gang 2:102).
> Inge
>
> On 29 July 2011 15:51, Kenneth J. Wood <[log in to unmask]> wrote:
>
>> Hi all,
>>
>> I have a PCB that operates inside a vacuum chamber under ultra high
> vacuum.
>>
>> The material can't outgas and needs to hold up physically under the
>> pressure
>> (or lack thereof).
>>
>> I wanted to use RO3003 but may need something else, any suggestions?
>>
>> Material lead time is an issue as well which is why I'm looking...
>> Thanks
>>
>> Ken
>>
>> _____________________________________
>>
>> Kenneth J. Wood
>>
>> Saturn PCB Design, Inc.
>>
>> www.saturnpcb.com
>>
>>
>>
>>
>>
>>
>>
>>
>>
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