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July 2011

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Subject:
From:
"Kenneth J. Wood" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kenneth J. Wood
Date:
Fri, 29 Jul 2011 13:42:10 -0400
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text/plain
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text/plain (105 lines)
what about TMM materials?
Ken

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Friday, July 29, 2011 1:33 PM
To: [log in to unmask]
Subject: Re: [TN] High Vacuum Substrate

Ken,
you can't use organic substrates at 10exp-12 mBar. Use ceramic substrates.
The organic binder in RO3003 never  stops outgassing.
. A typical Pyrex glass system may need as much as +400 Centigrade baking
and one week pumping to achieve 10exp-14, as a comparison.
All depends on the volume and the gaskets etc. (Maissel & Gang 2:102).
Inge

On 29 July 2011 15:51, Kenneth J. Wood <[log in to unmask]> wrote:

> Hi all,
>
> I have a PCB that operates inside a vacuum chamber under ultra high
vacuum.
>
> The material can't outgas and needs to hold up physically under the
> pressure
> (or lack thereof).
>
> I wanted to use RO3003 but may need something else, any suggestions?
>
> Material lead time is an issue as well which is why I'm looking...
> Thanks
>
> Ken
>
> _____________________________________
>
> Kenneth J. Wood
>
> Saturn PCB Design, Inc.
>
> www.saturnpcb.com
>
>
>
>
>
>
>
>
>
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