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July 2011

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Subject:
From:
Charming Chan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charming Chan <[log in to unmask]>
Date:
Mon, 25 Jul 2011 11:27:28 -0400
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Hi TechNet, 

Our hardware engineer plans to use a 30mm*30mm size, 2.5mm height LGA component on our network equipment. We didn't use any LGA component before and then had limited experience on LGA application. So, we are here to ask TechNet for some advice on solder joint reliability and long-term reliability with LGA application. Thanks a lot.

BTW, do we need to underfill to improve reliability?

Best Regards
Charming Chan


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