We are just starting out in Select soldering here- running about six months. I am interested in what other user's have done to qualify and develop the select solder process parameters. We've got an Ersa machine here- no problem with the machine but want to optimize the process).

I don't have the luxury of running production boards to determine the optimum machine parameters to reduce defects (i.e. insufficient solder, solder skips, insufficient topside flow).  I was wondering if anyone knew of a commercially available  mixed technology test board ( bottom side SMT parts and through hole devices) to run a Design of Experiments. The machine parameters I was going to look at are below:

Selective solder Design of Experiment

Variables

1.       Solder pot temp (3 levels)

2.       Solder nozzle height to pin Z distance (2 levels)

3.       Solder nozzle X/Y speed (3 levels)

4.       Z axis speed (2 levels)

5.       Flux amount (2 levels)

6.       Length of solder tail- max length of continuous solder path without solder dwell(control this by having several start/stop while running a single pass).

7.       Lead Length (2 levels)

Noise



1.       Lead length versus solder mask clearance/pitch

2.       Solder mask type (dry film vs. LPI)

3.       Nitrogen purity

4.       Board finish (HASL vs. ENIG vs. OSP)

5.       Flux type

6.       Nozzle wettability

7.       Nozzle calibration/axis repeatability

Any assistance or lessons learned would be appreciated.

Best Regards

Tom Gervascio
Staff Manufacturing Engineer- Automated Processes
Lockheed Martin
Ocala Operations
352-687-5442







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