Dear All,

 

Can some kind souls help me to interpret the below statement taken out
from IPC-A-610 Section 10.5.2.2 Conformal Coating - Coverage? I am look
at Class 3 and I am loss on its interpretation, especially 'Voids or
bubbles'.

 

Acceptable - Class 1, 2, 3

No bridging of adjacent lands or conductive surfaces from :

*         Loss of adhesion (mealing)

*         Voids or bubbles

*         Dewetting

*         Cracks

*         Ripples

*         Fisheyes or orange peel

 

It is common to find bubbles trapped between the soldered leads of those
gull-leaded components and between closely mounted SMDs passives for
brushing method. Are these bubbles allow for Class 3?

 

Thanks and regards,

~wee mei~


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